11:00 | Registration and coffee |
11:00-13:00 | Labtour |
12:00-13:00 | Lunch |
13:15 | Welcome |
13:30 | Industrial packaging (requirements) |
14:30 | Networking break |
15:00 | Components and processes |
16:00 | Networking Break |
16:30 | Packaging services |
17:30 | Apéro |
19:00 | End |
Technologies and Markets - III |
Program | ||
Peter Moselund, CEO Swiss PIC Link | Welcome | |
Christian Bosshard, Managing Director Swissphotonics Link | Welcome | ![]() |
Guillaume Basset, Micro-Nano-Optics group leader CSEM Link | Welcome | ![]() |
Christoph Harder, President Swissphotonics Link | Moderation Industrial packaging (requirements) | |
Maxim Karpov, Co-founder Enlightra Link | Challenges of PIC packaging for nonlinear photonics | ![]() |
Marcus Duelk, CTO EXALOS Link | Micro-optical free-space assembly for semiconductor light sources from the visible to the near-infrared wavelength range | |
Nikolaus Flöry, BD Manager Vario-optics Link | Board-Level Photonics: Embedded Waveguides solving Photonic Chip Assembly Bottlenecks | ![]() |
Peter Moselund, CEO Swiss PIC Link | Moderation Components and processes | |
Myun-Sik Kim, Principal Strategic Business Development Axetris Link | An Industrial Perspective: How Microlenses Define the Path of Photonics Integration | ![]() |
Rolando Ferrini, Chief Regional Officer; Head of FEMTOprint Neuchâtel Link | From high-precision glass micro-components to monolithically integrated glass micro-systems for fiber-to-chip connectivity | ![]() |
Ivan Shorubalko, EMPA Link | Towards a digital Lippmann camera: integration challenges | ![]() |
Andreas Voelker, Head of Research & BD Photonics CSEM Link | Moderation Packaging services | |
Tobias Lamprecht, Innovation Microtechnology and Photonics OST Link | Microtechnology approaches for customized photonic packages | ![]() |
Mark Fretz, R&D engineer CSEM Link | Photonic chip integration strategies for micro-fluidic cartridges | ![]() |
Peter Moselund, CEO Swiss PIC Link | PIC Packaging and Swiss PIC | ![]() |