PIC

Wed, 23.06.2021, Overbooked

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PIC - Photonic Integrated Circuits: from telecom to sensing

Photonic Integrated Iircuits PICs have demonstrated their disruptive potential in miniaturizing classical optical systems in size, weight, power and cost with increased performance at the same time. It is a fast-growing market with annual growth rates above 25% and it is expected to reach about 1.5 billion USD by 2023.

Application benefit from the precise waveguide geometries for mode engineering, novel material integration, resonance enhancement through ultra-high quality factors. High speed telecom transceivers are already based on PIC technologies and the next generation LiDAR sensors and the first photonic quantum computers are as well.

Switzerland has a leading edge in this exiting field and the aim of the workshop is to exchange on how PICs enable novel solutions and applications in the field of sensing, metrology, nonlinear optics and quantum technologies.


IEEE Spectrum

Date
Wednesday, 23 June 2021

Agenda  
12:45 Checkin
13:00 Talks
14:10 Break out Session
14:25 Coffee Break
14:40 Talks
15:40 Break out Session
15:55 Coffee Break
16:10 Talks
17:10 Break out Session
17:30 End

Language
The presentations will be held in english.

Costs
This Workshop is free of charge

Registration
The registration-link is on top of the page. We will send you the access information (Zoom-link and ID) a few days before the event.
If you would like to register more than one participant, please fill for each an individual form.
The number of participants is limited to 100, first come first serve.
Registration closed due to overwhelming demand. Thank you for your understanding.

Contact Swissphotonics
Dr. Christian Bosshard
Managing director Swissphotonics
+41 79 405 18 26

23 June 2021, Beni Muller + Iris Bollinger
Speaker PIC
Program
Dr. Christoph S. Harder; President Swissphotonics, 8832 Wollerau SZ
Link
Content Moderation
Dr. Christian Bosshard; Managing director Swissphotonics, 4415 Lausen BL
Link
Introduction Bosshard
Marco Mayer; Area Manager Hamamatsu Photonics France-Swiss Office, 4500 Solothurn
Link
PIC - How to choose between Monolithic and Hybrid Mayer
Prof. Dr. Niels Quack; Head Photonic Micro- and Nanosystems and Integrated Transducers Research Group Q-Lab, EPFL, 1015 Lausanne VD
Link
Enhancing PICs with MEMS Quack
Dr. Thomas Hessler; Director of Ligentec SA, 1024 Ecublens Lausanne VD
Link
Silicon Nitride - a versatile, low loss PIC platform Hessler
Prof. Dr. Rachel Grange; Associate Professor at the Optical Nanomaterial Group ONG at the Institute for Quantum Electronics, ETH, 8093 Zürich
Link
An electro-optic integrated platform for telecom and sensing devices Grange
Dr. Stefan Abel; Co-Founder and Co-CEO of Lumiphase AG, 8802 Kilchberg ZH
Link
Pockels-enhanced ultra-efficient photonic chips Abel
Prof. Dr. Tobias Kippenberg; Head Laboratory of Photonics and Quantum Measurements K-Lab, 1015 Lausanne VD
Link
Nonlinear Hybrid Integrated Photonics Kippenberg
Dr. Claudia Hössbacher; Co-Founder and CEO of Polariton Technologies AG, 8038 Zürich
Link
Plasmonics - a Powerful Platform for Next-Generation Integrated Circuits Hössbacher
Dr. Victor Brasch; Senior R&D engineer Laser and Quantum Tech at CSEM SA, 2000 Neuchâtel
Link
Supporting a Swiss PIC ecosystem – services & opportunities at CSEM Brasch
Tobias Müller; Technical Director CTO Aixemtec GmbH, D-52134 Herzogenrath, Nordrhein-Westfalen, D
Link
Full-service Automation Technologies for Risk minimization and cost-effective scaling of production Müller
Swissphotonics, Verein Schweizer Laser und Photonik Netz VSLP | Sihleggstrasse 23 | CH-8832 Wollerau | E-Mail | |